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Micro and Nano Processing

Coating process

What is coating?

Coating (thin film deposition) is a process by which a thin film is deposited on the surface of a material through a coating process, thereby changing the properties of the material or increasing its functionality. The coating process is widely used in the fields of materials science, semiconductor manufacturing, optics and electronics manufacturing.

The main coating processes include physical vapor deposition (PVD), chemical vapor deposition (CVD), and atomic layer deposition (ALD).

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coating material

Metallic materials:
Ti (Titanium), Al (Aluminum), Cr (Chromium), Pt (Platinum), Bi (Bismuth), Mo (Molybdenum), W (Tungsten), Ta (Tantalum), Ni (Nickel), Au (Gold), Ag (Silver), Sn (Tin), In (Indium), Ge (Germanium), and others.

Compound materials:
SiO2 (Silicon Dioxide), SiNx (Silicon Nitride), ITO (Indium Tin Oxide), Al2O3 (Aluminum Oxide), Ta2O5 (Tantalum Oxide), TiO2 (Titanium Dioxide), AlN (Aluminum Nitride), TaN (Tantalum Nitride), ZnO (Zinc Oxide), HfO2 (Hafnium Oxide), ZrO2 (Zirconium Oxide), Si3N4 (Silicon Nitride), PZT ( PbZT (Lead Zirconium Titanate), ScAlN (Scandium Aluminum Nitride), AuSn (Gold Tin), TiAl (Titanium Aluminum), TiNi (Titanium Nickel), TiW (Titanium Tungsten), TiN (Titanium Nitride), AuBe (Gold Beryllium), AuGeNi (Gold Germanium Nickel), and so on.

Coating Technology

Metal magnetron, dielectric magnetron, electron beam evaporation, thermal evaporation, PECVD, LPCVD, ICPCVD, PVD, ALD atomic layer deposition

 

Micro and Nano Processing

CVD Subcontracting

CVD (Chemical Vapor Deposition) processing enables high-quality, uniform film deposition, meets the specific needs of different industries and applications, controlled film thickness and composition, is suitable for complex structured substrate surfaces, and is performed at elevated temperatures to increase reaction rates and film crystallinity.

Micro and Nano Processing

PVD Subcontracting

PVD (Physical Vapor Deposition) processing enables uniform and high-quality film deposition, meets the specific needs of each industry, allows for control of film thickness and composition, is suitable for substrate surfaces with complex structures, and is performed at lower temperatures, thus reducing the risk of thermal stress on the substrate.

Micro and Nano Processing

ALD OEM

ALD (Atomic Layer Deposition) processing achieves extremely uniform and dense film deposition, meets industry-specific requirements, provides ultra-high precision control of film thickness and composition, and is suitable for a wide range of substrates and complex surfaces, while operating at low temperatures, helping to minimize the risk of thermal stress on the substrate.
Customization Process

1. Communication needs

According to your needs, our R&D engineers will develop the optimal processing solution

2. Program offer

Quotation based on the processing solution

3.Production and quality control

Quality control, fully responsible for your products to meet our standards of production

4. Delivery on time

Deliver the product to you within one week on schedule

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